Thermaltake CTE C750 Air - FT - utvidet ATX (E-ATX) - sidepanel med vindu (herdet glass) - ingen strømforsyning (PS/2) - svart - USB/lyd
FBAC4895-B52C-4E03-B099-A6A8F8B8017B Created with sketchtool. 706D6907-81E1-46A2-B8F9-7B702A1EF2C7 Created with sketchtool. 6A870209-E7F5-44F5-A66F-09E20C85A0DC Created with sketchtool. 0BB04D6C-A9AB-4913-BF4F-5A23954E68E1 Created with sketchtool. 501E26C7-66C1-4DAA-B740-6CFAF55A1B39 Created with sketchtool. C105F7D3-D5EE-43C9-9EE8-05CC42B296D4 Created with sketchtool. D94689D8-7CBB-41C8-AC06-F79D81FF82D5 Created with sketchtool. DA4C7ED9-2512-4D52-94F0-92800F2A6E04 Created with sketchtool. 42E133FD-828F-4CF4-A0BF-560014487A57 Created with sketchtool. F52D9745-4BFD-4506-BEEF-630FD09EF2D9 Created with sketchtool.
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The CTE C750 Air is a specially designed E-ATX full tower chassis from the CTE form factor series that emphasizes maximum airflow and is designed to provide high levels of thermal performance to critical components. It comes with three pre-installed 140 mm CT140 fans and can support up to 420 mm AIO radiators at the front, motherboard side and rear of the chassis.

The CTE form factor designed by Thermaltake, stands for Centralized Thermal Efficiency, and is focused around providing high level thermal performance to critical components. The design utilizes a 90-degree rotation of the motherboard providing more efficient airflow pathways.

Since the CPU location has been moved much closer to the front panel and the graphics card moved closer towards the rear panel, independent cold air induction is given for thermal dissipation of the CPU and graphics card respectively. This overall approach has allowed CTE to provide better and more efficient intake airflow through the placement of main components and cooling, as well as optimization to heat extraction from the system.